COOLING MICROELECTRONIC DEVICES USING OPTIMAL MICROCHANNEL HEAT SINKS. Revista EIA, [S. l.], v. 12, n. 24, p. 151–166, 2015. DOI: 10.24050/reia.v12i24.880. Disponível em: https://eiaupgrade.metarevistas.org/index.php/reveia/article/view/880. Acesso em: 18 jul. 2025.